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Spherical alumina powder has core applications in various fields such as electronics, new energy, chemical engineering, ceramics, 3D printing, etc. due to its high sphericity, high thermal conductivit
2026-01-23
Spherical Alumina Powder has core applications in various fields such as electronics, new energy, chemical engineering, ceramics, 3D printing, etc. due to its high sphericity, high thermal conductivity, low wear, and easy filling.
-Electronic thermal conductivity (mainstream)
-Thermal interface material TIM: It has good filling dispersion, and is suitable for silicone grease, gel, phase change sheet, covering CPU/GPU, LED, IGBT, etc., accounting for about 48% of spherical alumina applications.
-Electronic packaging and encapsulation: used in epoxy resin and silicone systems to enhance thermal conductivity and temperature resistance, suitable for semiconductor plastic encapsulation and power module encapsulation.
-Thermal conductive engineering plastics: filled with PA, PPS, etc., used for 5G base station casings and automotive electronic casings, accounting for about 17%.
-Aluminum based copper-clad laminate (CCL): filled with insulation adhesive layer to enhance substrate thermal conductivity and insulation, accounting for about 14%.
-New energy three electricity: battery pack thermal pad, electronic control sealing adhesive, motor insulation heat dissipation, to suppress thermal runaway.
-Ceramics and refractory materials
-Used as a structural ceramic raw material to enhance strength and toughness, reduce sintering temperature, and for wear-resistant ceramics and insulating ceramic parts.
-Used for lining refractory bricks, crucibles, and high-temperature furnaces, with high temperature resistance, thermal shock resistance, and low thermal expansion.
-Catalysts and carriers
-The carrier for petrochemical hydrogenation/reforming reactions has high specific surface area, controllable pore size, good flowability, low wear, and long service life.
-Vehicle exhaust purification catalyst carrier enhances catalytic efficiency and stability.
-Grinding and polishing
-Polishing media for precision optics, semiconductors, and electronic glass, with no scratches and high surface smoothness, suitable for sapphire substrates and wafer backside grinding.
-Surface protective coating
-Thermal spraying (plasma/flame) is used to prepare wear-resistant, high-temperature resistant, and corrosion-resistant coatings for aircraft engine blades, automotive engine components, and industrial valves.
-3D printing
-High sphericity powder suitable for SLS, SLM, and binder spraying, used for high-temperature resistant structural components, ceramic cores, and lightweight aerospace parts, with high molding accuracy and good mechanical properties.
-Friction material: used for brake pads and clutch plates to enhance wear resistance and thermal conductivity, and stabilize friction coefficient.
-Electrical insulation: High voltage cable insulation layer filler, thermal conductivity+insulation, improves current carrying capacity and stability.
Particle size of spherical alumina powder
-Particle size: micrometer scale (1-50 μ m) suitable for thermal conductivity filling; Submicron/nanometer scale adaptation for precision polishing and catalyst support.
-Alpha phase content: The higher the thermal conductivity and temperature resistance, the better. For electronics and ceramics, it is preferred to be ≥ 99%.
-Surface modification: Silane/titanate modification improves compatibility with organic matrices, reduces viscosity, and increases filling content.
